Intel’s glass substrates are coming to the processors of the future

What’s a house without a strong foundation?

Chris Szewczyk

Computer chip technology marches ever on. We’re used to seeing chips with more cores, more cache, and more transistors at smaller nodes, but what we don’t often focus on is a chip’s packaging and substrate. Current organic substrates are nearing their limits. Intel knows this and has been researching new substrate materials to enable the next generation of chip design. The answer is glass. In this issue, you can read about my experiences at Intel’s Malaysian facilities, where I witnessed first hand how Intel goes about assembling its chips. I saw Meteor Lake chips being made. But while Meteor Lake and its tile-based architecture is impressive, it pales in comparison to Intel’s compute GPU, codenamed Ponte Vecchio. It has a die area of 1,280mm² and packs in no less than…

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APC (Digital) - 1 Issue, November 2023

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